I-Silver Coated Copper Powder Amathemba Abanzi

I-elekthronikhi yokunamathisela iyisisekelo esibalulekile sokukhiqiza izingxenye ze-elekthronikhi.Isetshenziswa kabanzi kumamojula we-solar photovoltaic, ukupakishwa kwe-chip, amasekhethi aphrintiwe, izinzwa kanye nokuhlonza imvamisa yomsakazo neminye imikhakha.I-Silver paste ibaluleke kakhulu futhi isetshenziswa kabanzi, enosayizi wemakethe ongamashumi ezigidigidi.Kodwa-ke, isiliva liyinsimbi eyigugu futhi liyabiza, ngakho-ke kuphuthuma kakhulu ukuthuthukisa imikhiqizo yokunamathisela yesiliva ebiza kancane futhi esebenza kakhulu.I-Copper, enezimfanelo zikagesi nezishisayo ezifanayo nesiliva, i-1% kuphela yenani lentengo yesiliva.Kodwa-ke, ithusi i-oxidized kalula emoyeni, ngakho-ke i-sintering yayo noma ukuphulukiswa kwayo kufanele kwenziwe ngaphansi kokuvikelwa kwamagesi angenayo (njenge-nitrogen, i-argon, njll.), evimbela kakhulu ukusetshenziswa kwayo emkhakheni we-electronic paste.Ngakho-ke, i-powder yethusi ehlanganiswe ngesiliva ecabangela kokubili intengo nokusebenza kuyoba yisinqumo esihle.

I-Silver camera yethusi isebenzisa ubuchwepheshe bezinhlayiya zethusi ezihlanganiswe ngesiliva, ezinamandla amakhulu emakethe.Ukukhiqizwa kwe-Huarui kusebenzisa i-electroplating ukwakha i-uniform nesiliva eminyene phezu kwezinhlayiya ze-powder yethusi, ezinganciphisa ngempumelelo inani lesiliva elisetshenziswayo futhi ngaleyo ndlela kunciphise izindleko zokunamathisela, futhi kuvimbele ukumelana kwezinhlayiya zethusi ekukhuleni ngenxa ye-oxidation ebusweni. ngesikhathi sintering, njll umbuzo.(Uma kuqhathaniswa nezindlela zamakhemikhali, i-electroplating inesendlalelo sesiliva esiminyene kanye nokumelana ne-oxidation okungcono).Okuqukethwe kwesiliva kungalungiswa ngokuhambisana nesilinganiso sika-r0 no-r1 radii, ngokuvamile okuqukethwe kwesiliva kumpushana wethusi ohuqwe ngesiliva kuphakathi kuka-10% no-30%.

U-Ag ugcotshwe u-Cu powder

Izici zempushana yethusi ehlanganiswe ngesiliva:

1) Usayizi wezinhlayiyana ze-powder yethusi ehlanganiswe ngesiliva mncane, kuze kufike ezingeni le-submicron.

I-2) Impushana yethusi ehlanganiswe ngesiliva ine-morphology eminingi, kuhlanganise nebhola, ishidi, i-dendritic nokunye.

Ag camera Cu powder SEM

3) Impushana yethusi ehlanganiswe ngesiliva inokusebenza okuhle kakhulu kukagesi kanye nezindleko eziphansi, ezingangena esikhundleni sezinye izinkambu zokusetshenziswa kwempushana yesiliva.

4) Impushana yethusi ehlanganiswe ngesiliva inokumelana ne-oxidation nokuhlakazeka okuhle, futhi ingasetshenziswa ekunamathisele okushisa okuphakathi nendawo nokuphansi.

I-powder yethusi ehlanganiswe ngesiliva ingasetshenziswa kuma-adhesives conductive, i-conductive coatings, inkino ye-conductive, i-polymer pastes, nezinkambu ezihlukahlukene zobuchwepheshe be-microelectronics ezidinga i-conductivity kanye nogesi omile, kanye ne-non-conductive material surface metallization.Iwuhlobo olusha lwe-conductive composite Powder.Impushana yethusi ehlanganiswe ngesiliva isetshenziswa kabanzi kuma-electronic, mechanical and electrical, ukuxhumana, ukuphrinta, i-aerospace, ezempi nezinye izimboni ze-conductive, i-electromagnetic shielding fields.Okufana namakhompiyutha, omakhalekhukhwini, amasekhethi ahlanganisiwe, zonke izinhlobo zezinto zikagesi, okokusebenza kwezokwelapha kagesi, amathuluzi kagesi neminye imikhiqizo eqhutshwayo, ukuvikela i-electromagnetic

I-Chengdu Huarui Industrial Co., Ltd.

Email: sales.sup1@cdhrmetal.com

Ucingo: +86-28-86799441


Isikhathi sokuthumela: Jan-17-2023