I-Titanium Nitride Coating TiN Titanium Nitride Powder
Incazelo Yomkhiqizo
Kunezinhlobo ezimbili ze-Titanium nitride powder:
1. I-Ti2N2, impushana ephuzi.
2. I-Ti3N4, impushana emnyama empunga.
I-Titanium nitride inezakhiwo ezinhle zomzimba namakhemikhali ezifana nephuzu eliphakeme lokuncibilika, ukuzinza okuhle kwamakhemikhali, ukuqina okuphezulu, ukuqhutshwa kahle kukagesi kanye ne-thermal conductivity kanye nezakhiwo ezibonakalayo, ukuze kube nokusetshenziswa okubaluleke kakhulu emikhakheni ehlukahlukene, ikakhulukazi emkhakheni wensimbi entsha. izitsha zobumba kanye negolide esikhundleni sokuhlobisa.Isidingo semboni ye-titanium nitride powder siyakhula.Njengokwemboza, i-titanium nitride ibiza imali eningi, ayigugi futhi imelana nokugqwala, futhi izici zayo eziningi zingcono kune-vacuum coatings.Ithemba lokusetshenziswa kwe-titanium nitride libanzi kakhulu.
Ukucaciswa
| Ukwakhiwa kwe-Titanium nitride powder | |||
| Into | I-TiN-1 | I-TiN-2 | I-TiN-3 |
| Ubumsulwa | >99.0 | >99.5 | >99.9 |
| N | 20.5 | >21.5 | 17.5 |
| C | <0.1 | <0.1 | 0.09 |
| O | <0.8 | <0.5 | 0.3 |
| Fe | 0.35 | <0.2 | 0.25 |
| Ukuminyana | 5.4g/cm3 | 5.4g/cm3 | 5.4g/cm3 |
| usayizi | <1micron 1-3micron | ||
| 3-5micron 45micron | |||
| ukwanda okushisayo | (10-6K-1):9.4 impushana emnyama/ephuzi | ||
Isicelo
1. I-Vanadium nitride iyisengezo esingcono sokwenza insimbi kune-ferrovanadium.Ngokusebenzisa i-vanadium nitride njengesithasiselo, ingxenye ye-nitrogen ku-vanadium nitride ingakhuthaza ukuna kwe-vanadium ngemva kokusebenza okushisayo, yenze izinhlayiya ezinamanzi zibe ngcono, ukuze kuthuthukiswe kangcono Ukushisela nokusimama kwensimbi.Njengesengezo esisha nesisebenzayo se-vanadium alloy, singasetshenziswa ukukhiqiza imikhiqizo yensimbi enamandla aphansi enengxubevange efana nezinsimbi ezishiselwe amandla aphezulu, izinsimbi ezingacimi nezipholile, izinsimbi zamathuluzi anesivinini esikhulu, nezinsimbi zamapayipi aqine kakhulu.
2. Ingasetshenziswa njenge-hard alloy impahla eluhlaza ukukhiqiza amafilimu angagugi kanye nama-semiconductor.
